发明名称 METHOD OF FORMING A SEMICONDUCTOR DEVICE FEATURING A GATE STRESSOR AND SEMICONDUCTOR DEVICE
摘要 <p>A semiconductor device (10) is formed in a semiconductor layer (12). A gate stack (16,18) is formed over the semiconductor layer and comprises a first conductive layer (22) and a second layer (24) over the first layer. The first layer is more conductive and provides more stopping power to an implant than the second layer. A species (46) is implanted into the second layer. Source/drain regions (52) are formed in the semiconductor layer on opposing sides of the gate stack. The gate stack is heated after the step of implanting to cause the gate stack to exert stress in the semiconductor layer in a region under the gate stack.</p>
申请公布号 WO2008150684(A1) 申请公布日期 2008.12.11
申请号 WO2008US64105 申请日期 2008.05.19
申请人 FREESCALE SEMICONDUCTOR INC.;WINSTEAD, BRIAN, A.;LOIKO, KONSTANTIN, V.;THEAN, VOON-YEW 发明人 WINSTEAD, BRIAN, A.;LOIKO, KONSTANTIN, V.;THEAN, VOON-YEW
分类号 H01L21/28;H01L21/302 主分类号 H01L21/28
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