发明名称 |
LIGHT-EMITTING DIODE WITH LOW THERMAL RESISTANCE |
摘要 |
A light-emitting diode (LED) structure providing an improved heat transfer path with a lower thermal resistance than conventional LEDs without significantly deviating from the conventional dimensions is described. For some embodiments, a light-emitting diode structure is illustrated that includes a lead frame that is substantially exposed for low thermal resistance by positioning it on the bottom of the light-emitting diode structure. An LED semiconductor chip is electrically and thermally conductively connected to at least one lead of the lead frame for external connection. In some embodiments, a lens or transparent cover plate may cover the LED structure to alter the properties of the emitted light.
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申请公布号 |
WO2007121198(A3) |
申请公布日期 |
2008.12.11 |
申请号 |
WO2007US66354 |
申请日期 |
2007.04.11 |
申请人 |
SEMILEDS CORPORATION;YEN, JUI-KANG |
发明人 |
YEN, JUI-KANG |
分类号 |
H01L27/15;H01L29/26;H01L31/12;H01L33/48;H01L33/58;H01L33/64 |
主分类号 |
H01L27/15 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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