A SYSTEM-IN-PACKAGE PLATFORM FOR ELECTRONIC-MICROFLUIDIC DEVICES

摘要

The present invention relates to an integrated electronic-microfluidic device an integrated electronic-microfluidic device, comprising a semiconductor substrate (106) on a first (122) support, an electronic circuit (102, 104) on a first semiconductor-substrate side of the semiconductor substrate, and a signal interface structure to an external device. The signal interface structure is arranged on the first semiconductor-substrate side and configured to receive electrical signals from the electronic circuit. A microfluidic structure (126) is formed in the semiconductor substrate, and is configured to confine a fluid and to allow a flow of the fluid to and from the microfluidic structure only on a second semiconductor-substrate side that is opposite to the first semiconductor-substrate side and faces away form the first support. The electronic-microfluidic device forms a flexible platform for the formation of various System-in-Package applications. It achieves a clear separation between electrical and wet-chemical interfaces. The claimed method for fabricating the device of the invention also allows a simple formation of thermally isolated microfluidic structures.