发明名称 |
Thin-plate supporting container |
摘要 |
The attaching-and-detaching operation of a lid unit, and the operation of taking in and out semiconductor wafers stored in a container body are facilitated. Thin-plate supporting units for supporting semiconductor wafers are provided in the container body of a thin-plate supporting container, and wafer holding units for pressing and supporting the semiconductor wafers, supported by the thin-plate supporting units, from a lid unit side are provided inside a lid unit. The area of a lower surface of a V-shaped groove of the wafer holding unit is increased. The V-shaped groove easily fits the peripheral portion of the semiconductor wafer when attaching the lid unit to the container body. The lower surface of a V-shaped groove of the thin-plate supporting portion is roughened to enhance slipping property with respect to the semiconductor wafer. The angle of inclination of a ridge is determined to be 2 to 5 degrees with respect to the horizontal direction. |
申请公布号 |
EP1538662(A3) |
申请公布日期 |
2008.12.10 |
申请号 |
EP20040018403 |
申请日期 |
2004.08.03 |
申请人 |
MIRAIAL CO., LTD. |
发明人 |
MATSUTORI, CHIAKI;OBAYASHI, TADAHIRO |
分类号 |
B65D85/86;H01L21/00;H01L21/673;H01L21/68 |
主分类号 |
B65D85/86 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|