| 摘要 |
A substrate processing apparatus is provided to reduce the manufacturing cost and increase the productivity by omitting the cleaning process for cleaning the dumper part. A substrate processing apparatus comprises the chamber(100), the substrate handling part, and the particle removal part. The chamber defines the reaction space in which the reaction gas is injected. The substrate handling part is equipped in the reaction space. The substrate is settled on the substrate handling part. The substrate handling part processes the substrate by using the reaction gas. The particle removal part is positioned between the side wall and the substrate handling part of the chamber. The particle generated in the process of forming the electric field and manufacturing the substrate is absorbed by the particle removal part.
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