发明名称 |
SEMICONDUCTOR INTEGRATED CIRCUIT |
摘要 |
On a semiconductor chip in a semiconductor integrated circuit, a plurality of circuit cells each of which has a pad are formed along a first chip side of the semiconductor chip. Furthermore, a wiring having a high voltage potential is formed on the circuit cells. The width of the wiring has a shape which widens in a longitudinal direction toward an end portion from the center portion. ® KIPO & WIPO 2009
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申请公布号 |
KR20080107351(A) |
申请公布日期 |
2008.12.10 |
申请号 |
KR20087014961 |
申请日期 |
2008.06.20 |
申请人 |
PANASONIC CORPORATION |
发明人 |
MATSUNAGA HIROKI;HISHIKAWA NAOKI;MAEJIMA AKIHIRO;KANEDA JINSAKU;ANDO HIROSHI |
分类号 |
H01L21/822;H01L21/82;H01L21/8234;H01L27/04 |
主分类号 |
H01L21/822 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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