发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 On a semiconductor chip in a semiconductor integrated circuit, a plurality of circuit cells each of which has a pad are formed along a first chip side of the semiconductor chip. Furthermore, a wiring having a high voltage potential is formed on the circuit cells. The width of the wiring has a shape which widens in a longitudinal direction toward an end portion from the center portion. ® KIPO & WIPO 2009
申请公布号 KR20080107351(A) 申请公布日期 2008.12.10
申请号 KR20087014961 申请日期 2008.06.20
申请人 PANASONIC CORPORATION 发明人 MATSUNAGA HIROKI;HISHIKAWA NAOKI;MAEJIMA AKIHIRO;KANEDA JINSAKU;ANDO HIROSHI
分类号 H01L21/822;H01L21/82;H01L21/8234;H01L27/04 主分类号 H01L21/822
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