发明名称 Method for forming conductive material layers in electronic components
摘要 A method of applying layers of material in the manufacture of electronic components, for example, capacitors, transistors or diodes comprises each layer being applied as a liquid precursor and then causing or allowing it to solidify to form a solid layer. A dispensing means for example, a needle dispenser 20 for delivering precursor liquid is provided, and the dispensing means comprises a delivery head adapted to deliver precursor liquid from the dispensing means. A transport means for moving the delivery head relative to a liquid delivery site and for aligning the delivery head with the liquid delivery site. One or more doses of liquid are delivered to the targeted delivery site in amounts suitable to form a layer of precursor material for example, a conductive polymer in a controlled amount at the desired location to form a cathode 27. The polymer may be applied in repeat cyles.
申请公布号 GB2449885(A) 申请公布日期 2008.12.10
申请号 GB20070010850 申请日期 2007.06.06
申请人 AVX LIMITED 发明人 BRIAN W GLASPER
分类号 H01G9/00;H01L21/00;H01L21/02;H01L51/00;H01L51/40 主分类号 H01G9/00
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