发明名称 Liquid Cooled Power Electronic Circuit Comprising Stacked Direct Die Cooled Packages
摘要 <p>A plurality of direct die cooled semiconductor power device packages (60/60') arc vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The packages (60/60') arc individually identical, and selectively oriented prior to stacking in order to form the desired circuit connections and laterally stagger the package leads (36, 40, 42).</p>
申请公布号 EP2001048(A1) 申请公布日期 2008.12.10
申请号 EP20080154113 申请日期 2008.04.04
申请人 DELPHI TECHNOLOGIES, INC. 发明人 MYERS, BRUCE;RATELL, JOSEPH M.
分类号 H01L23/473;H01L25/065 主分类号 H01L23/473
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