发明名称 TRENCH DMOS TRANSISTOR STRUCTURE
摘要 A trench DMOS transistor structure having a low resistance path to a drain contact located on an upper surface and methods of making the same. The transistor structure comprises: (1) a first region of semiconductor material of a first conductivity type; (2) a gate trench formed within the first region; (3) a layer of gate dielectric within the gate trench; (4) a gate electrode within the gate trench adjacent the layer of gate dielectric material; (5) a drain access trench formed within the first region; (6) a drain access region of conductive material located within the drain access trench; (7) a source region of the first conductivity type within the first region, the source region being at or near a top surface of the first region and adjacent to the gate trench; (8) a body region within the first region below the source region and adjacent to the gate trench, the body region having a second conductivity type opposite the first conductivity type; and (9) a second region of semiconductor material within the first region below the body region. The second region is of the first conductivity type and has a higher dopant concentration than the first semiconductor region. Moreover, the second region extends from the gate trench to the drain access trench and is self-aligned to both the gate trench and the drain access trench.
申请公布号 EP1504473(A4) 申请公布日期 2008.12.10
申请号 EP20030728855 申请日期 2003.05.13
申请人 GENERAL SEMICONDUCTOR, INC. 发明人 BLANCHARD, RICHARD, A.
分类号 H01L29/78;H01L21/336;H01L29/06;H01L29/08;H01L29/36;H01L29/417 主分类号 H01L29/78
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