IC MODULE, IC INLET AND IC MOUNTED BODY

摘要

An IC module including: an insulating substrate 11; antenna connection terminals 16a and 16b provided on one surface of the insulating substrate 11; and a laminated body 15 in which an IC chip 14 and a mica capacitor 13 are laminated, wherein the laminated body 15 and the antenna connection terminals 16a and 16b are mounted on the same surface side of the insulating substrate 11, and the IC chip 14 and the mica capacitor 13 are electrically connected with the antenna connection terminals via a wire, the IC module capable of producing an IC mounted body that has highly accurate resonance frequency and is highly reliable in non-contact communications, and also capable of producing an IC mounted body having a small area since the mounting thereof on a small area is possible, and which can be produced by a general purpose apparatus for producing IC modules, as well as an IC inlet and an IC mounted body using the IC module are provided.