| 摘要 |
PURPOSE: A semiconductor package and a method for manufacturing a bump of the same are provided to be capable of securing the electrical connection between a terminal pad of the semiconductor package and a pad of a board. CONSTITUTION: A semiconductor package is provided with a semiconductor chip(51) having a terminal pad(57), the core(52) of zinc formed at the upper portion of the terminal pad of the semiconductor chip, a nickel bump part(53) for enclosing the core of zinc, and the first plating layer(55) formed on the entire surface of the nickel bump. At this time, the center portion of the resultant structure is relatively protruded from the peripheral portion. Preferably, nonconducting paste is used for bonding the bump part to a circuit pattern of a board. Preferably, the first plating layer is made of one selected from a group consisting of gold, gold alloy, stannum, or stannum alloy. |
