发明名称 |
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE TRANSFER APPARATUS, SUBSTRATE CLAMP APPARATUS, AND CHEMICAL LIQUID TREATMENT APPARATUS |
摘要 |
<p>Provided is a substrate treating device capable of improving a tact time of a substrate treatment process. A polishing device as the substrate treating device includes a plurality of polishing units (3a, 3b) for polishing a semiconductor wafer (W) and a swing transporter (7) for conveying the wafer (W). The swing transporter (7) includes a wafer grasping mechanism (112) for grasping the wafer (W), a vertical motion mechanism (104, 106) for vertically mobbing the wafer grasping mechanism (112) along a frame (102) of a case of the polishing unit (3a), and a rotary mechanism (108, 110) for rotating the wafer grasping mechanism (112) around an axis adjacent to the frame (102). ® KIPO & WIPO 2009</p> |
申请公布号 |
KR20080106933(A) |
申请公布日期 |
2008.12.09 |
申请号 |
KR20087022863 |
申请日期 |
2007.02.21 |
申请人 |
EBARA CORPORATION |
发明人 |
TAKAHASHI NOBUYUKI;NISHIDA HIROAKI;TORII HIROOMI;ISOBE SOICHI;SONE TADAKAZU;KOSUGE RYUICHI;KANEKO HIROYUKI;SOTOZAKI HIROSHI;MITSUKURA TAKAO;OGAWA TAKAHIRO;SUGITA KENICHI |
分类号 |
H01L21/304;B24B37/34;B65G49/07;H01L21/677 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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