发明名称 |
Method for fabricating a circuit component |
摘要 |
A method for fabricating a metallization structure comprises depositing a first metal layer; depositing a first pattern-defining layer over said first metal layer, a first opening in said first pattern-defining layer exposes said first metal layer; depositing a second metal layer over said first metal layer exposed by said first opening; depositing a second pattern-defining layer over said second metal layer, a second opening in said second pattern-defining layer exposes said second metal layer; depositing a third metal layer over said second metal layer exposed by said second opening; removing said second pattern-defining layer; removing said first pattern-defining layer; and removing said first metal layer not under said second metal layer.
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申请公布号 |
US7462558(B2) |
申请公布日期 |
2008.12.09 |
申请号 |
US20080025002 |
申请日期 |
2008.02.02 |
申请人 |
MEGICA CORPORATION |
发明人 |
LIN MOU-SHIUNG;CHOU CHIU-MING;CHOU CHIEN-KANG;LO HSIN-JUNG |
分类号 |
H01L21/4763;H01L21/60;H01L23/485;H01L23/532 |
主分类号 |
H01L21/4763 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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