| 摘要 |
A manufacturing method of a substrate having a penetrating electrode is provided to prevent the damage of the penetrating electrode of a substrate and reduce the manufacturing cost of the substrate and prevent void generation at the penetrating electrode. A manufacturing method of a substrate having a penetrating electrode comprises: a penetration electrode formation step forming a penetrating electrode(14) on a supporting plate; a producing wiring board step forming the substrate(10) having penetration hole; a penetrating electrode adoption step laminating substrate onto the supporting plate, and accommodating the penetrating electrode to the penetration hole; a resin filling step filling crevice between the inner wall of the penetration hole(18) of the substrate and the side of the penetrating electrode with resin(12); and a supporting plate decimation step removing the supporting plate after the resin filling step. In the penetration electrode formation step, the penetrating electrode is formed owing to electroplating. |
