| 摘要 |
<p>PURPOSE: A connector for a stacked semiconductor package is provided to improve productivity and quality of the stacked semiconductor package by preventing a short-circuit defect caused by a transforming or soldering process of a connector. CONSTITUTION: A reinforcing material is attached to a surface of a metal layer(51). A plurality of leads are bent to be a predetermined shape toward one of an upper or lower part so that the surface to which the reinforcing material is attached faces the inside of the bent surface. The plurality of leads are formed outside the metal layer. Adhesive is formed on the upper and lower surfaces of the metal layer.</p> |
