| 摘要 |
A semiconductor laser diode package is provided to reduce a manufacturing cost by forming a heat sink by punching a metal plate through a press. Forward bent guide pieces(32) are formed on both sides of a vertical plate(31) of a heat sink(30) composed of a metal plate. A laser diode(42) fixed at a front surface of the vertical plate is protected. A bent piece(33) and a circulation groove(33a) are formed in the bottom of both guide pieces to discharge the heat. A ground piece(34) is integrated in the bottom center of the vertical plate. Terminal pieces(41) are fixed on both sides of an insulating plate(40) fixed and attached to the rear of the vertical plate. Both terminal pieces are connected to the laser diode through a wire(42a). |
