METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD AND INTERPOSER BOARD

摘要

A method for manufacturing a printed circuit board and an interposer board are provided to reduce an overall height of a package by reducing the height of the substrate through a planarization process. A small hole(14) is formed at one side to face other side. A penetrating hole(13) composed of a large hole(16) to enlarge a section at one side of the small hole is formed in a substrate(12). When punching the penetrating hole for forming a penetrating electrode(21), the filling is dense by reducing a filling depth by filling the conductive material in the small hole only through the penetrating hole with two stage structure. The filling process time is reduced.