METHOD FOR FORMING THROUGH INTERCONNECTION AND MANUFACTURING PRINTED CIRCUIT BOARD

摘要

A method for forming a penetration electrode and a method for manufacturing a printed circuit board are provided to improve electrical characteristic by forming the penetration electrode with densely filled conductive material without a void or a seam. A penetration hole(13) consisting of a small hole(14) to face from one side to other side and a large hole(16) of which cross section is enlarged in one end of the small hole, is formed in a substrate(12). The conductive material is filled in the small hole. The large hole is removed. The other surface of the substrate is ground and planed to expose the conductive material. The substrate is ceramic or silicon wafer.