| 摘要 |
An abrasive sheet for the semiconductor probe for inspection is provided to reduce the inspection cost and time by preventing the loss of probe. An abrasive sheet of the semiconductor probe for inspection is manufactured through the following steps: the step for forming the thin release film(10) on the bottom part; the step for forming the polyamide film(20) under which the silicon gluing agent(20a) is formed; the step for forming the silicone adhesive primer layer(30) coated onto the polyamide film with the thickness of 1 to 10mum; the step for forming the silicon abrasive sheet(40) from the outermost by the laser cutting equipment. The silicon abrasive sheet is made of the silicon fluid, the silicon carbide, and the platonic compound. The release film(50) of the circular sheet form is laminated on the top part.
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