发明名称 CHIP SCALE PACKAGE JIG SEPARATE SYSTEM
摘要 The chip scale package jig system is provided to reduce the cost and time by reducing the whole size of the semiconductor package processing method and semiconductor package working system. The CSP jig system for separating the chip scale package(CSP) strip jig(1124) comprises the loading unit, the separate unit, the vision part, the first unloader, the second unloader. The loading unit supplies the CSP jig. The separate unit separates the CSP strip and the CSP cover from the CSP jig. The vision part detects whether the chip scale package of the CSP strip seceded from the separate unit is the fault or not. The first unloader loads the jig seceded from the separate unit. The second unloader loads the CSP strip seceded from the separate unit.
申请公布号 KR100872054(B1) 申请公布日期 2008.12.05
申请号 KR20080045097 申请日期 2008.05.15
申请人 SHIN, GE CHEL 发明人 SHIN, GE CHEL
分类号 H01L21/68;H01L21/301;H01L21/66;H01L21/78 主分类号 H01L21/68
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