| 摘要 |
The present invention provides a CMP apparatus less susceptible to slurry adhesion, easy to cleaning off the adhering slurry therefrom and excellent in chemical resistance. The present invention is a CMP apparatus, at least one covered surface selected from the group consisting of a head portion surface and an arm portion surface for holding a polishing target member on a polishing pad, a slurry feed pipe surface and an apparatus main body inside wall being covered with a fluororesin.
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