发明名称 Heated embossing and ply bonding process
摘要 The present invention is generally directed to a process for hot embossing a base sheet and/or to a process for perforating and bonding multiple plies of a paper product together. The process can be used in order to apply a decorative pattern to a paper product and/or to bond multiple ply products together. In one embodiment, the process of the present invention includes feeding a previously formed single ply or multi-ply base sheet through a heated embossing nip. As the base sheet passes through the heated embossing nip, sufficient heat and pressure is imparted to cause the fibers within the sheet to begin to melt or glassinate. Upon cooling, inter-fiber bonding occurs resulting in a well-defined embossment as well as bonding between plies of a multi-ply product.
申请公布号 AU2002363951(C1) 申请公布日期 2008.12.04
申请号 AU20020363951 申请日期 2002.11.26
申请人 KIMBERLY-CLARK WORLDWIDE, INC. 发明人 TAMMY, L. BAUM;TIMOTHY, D. FERGUSON;ROGER, E. WENDLER JR;GEOFFREY, F. CARLOW;JAMES, A. WOOD;JAMES, L. BAGGOT;DANIEL, J. VANDERHEIDEN;PAUL, K. PAULING;ALEXANDER, F. GUNN
分类号 B31F1/07 主分类号 B31F1/07
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