SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To suppress the quality deterioration of high-frequency signals without using complicated steps in a semiconductor device that is formed by stacking a plurality of semiconductor chips.

SOLUTION: Semiconductor chips 1 and 2 are cut out from a semiconductor wafer in such a state that both of the chips are connected to a connection wiring 10 between the chips. Conductor bumps 12 are formed on the wiring layer at the uppermost layer. A thermosetting resin is coated on the semiconductor chip 1 [Fig.(a)], and the semiconductor chip 2 is folded and bonded onto the semiconductor chip 1 [Fig.(b)]. The semiconductor chip is bonded onto a substrate 3 by an adhesive 4 [Fig(c)]. After the semiconductor chip 1 and the substrate 3 are connected by a bonding wire 6 and sealed by a sealing resin 7, an external terminal 9 is formed on the back face of the substrate 3 [Fig.(d)].

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