| 摘要 |
PROBLEM TO BE SOLVED: To provide a sensor apparatus capable of facilitating jointing between a sensor substrate and a substrate in which a through-hole wiring is formed, having high joining reliability. SOLUTION: The sensor apparatus is provided with the sensor substrate 1 and a packaging substrate (the substrate in which through-hole wiring is formed) 2 sealed to one surface side of the sensor substrate 1. In the sensor substrate 1 and the packaging substrate 2, a first sealing metal layer 18 and a second sealing metal layer 28 formed in their opposite surfaces are jointed to each other, and a first metal layer 19 for electric connection and a second metal layer 29 for electric connection formed in their opposite surfaces are jointed to each other. In the packaging substrate 2, a joining section with the first metal layer 19 for electric connection in the second metal layer 29 for electric connection is displaced from a joining section with the through-hole wiring 24 in the second metal layer 29 for electric connection. COPYRIGHT: (C)2009,JPO&INPIT
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