| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a memory card and its manufacturing method for achieving miniaturization and the largely scaling of a storage capacity, and for achieving the reduction of manufacturing costs by increasing productivity. <P>SOLUTION: A memory card is provided with a first substrate; a first chip mounted in such a state that only a region in the neighborhood of one side of its lower face is faced to the first substrate; a second substrate mounted in such a state that the lower face of the first substrate is faced to its upper face; a second chip mounted in such a state that only a region in the neighborhood of one side of its lower face is faced to the second substrate, and that at least one portion of its upper face is joined to the lower face of the first chip; a third substrate mounted in such a state that the lower face of the second substrate is faced to its upper face; a third chip mounted in such a state that the lower face is faced to the upper face of the third substrate, and that at least a portion of the upper face is joined to the lower face of the second chip; and a cover part for covering the first chip, the first substrate, the second chip, the second substrate and the third chip. <P>COPYRIGHT: (C)2009,JPO&INPIT |
