发明名称 |
LIGHT SOURCE MODULE AND BACKLIGHT ASSEMBLY, DISPLAY DEVICE WITH THESE, AND METHOD FOR REDUCING THICKNESS OF BACKLIGHT ASSEMBLY |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light source module and a backlight assembly capable of slimming a display device by the reduction of the thickness of a light guide plate, the display device having these, and a method for reducing the thickness of the backlight assembly. <P>SOLUTION: The device includes a power supply plate, a light-emitting chip arranged on the power supply plate leaned to one side from the center of a first direction of the power supply plate, and electrically connected with the power supply plate, and a main body mold coupled with the power supply plate so that the light-emitting chip is exposed. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2008293979(A) |
申请公布日期 |
2008.12.04 |
申请号 |
JP20080136336 |
申请日期 |
2008.05.26 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
WOO SEUNG-GYUN;CHU YOUNG-BEE;LEE IK-SOO |
分类号 |
F21V8/00;F21S2/00;F21V23/00;F21Y101/02;G02F1/13357;H05B37/02 |
主分类号 |
F21V8/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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