| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can easily be manufactured and suppress cracking and peeling due to thermal stress, and to provide a method of manufacturing the semiconductor device. SOLUTION: The semiconductor device 10 has a semiconductor element 12 bonded to one surface 14a of a ceramic substrate 14 and a heat sink 13 thermally coupled to the other surface 14b through a metal plate 16. The heat sink 13 is provided with a projection portion 20 having a bonding surface 20a, having smaller area than the metal plate 16, and the bonding surface 20a is disposed inside a peripheral edge 16c of the metal plate 16 to thermally be coupled to the metal plate 16. COPYRIGHT: (C)2009,JPO&INPIT |
