发明名称 |
SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can achieve low power consumption by reducing the junction capacitance as compared with prior art by a simpler process, and to provide a manufacturing method thereof. <P>SOLUTION: A semiconductor film having a cavity between itself and a base substrate is formed on a base substrate by forming an insulating film having an opening on the base substrate and transposing a portion of a bond substrate to the base substrate while holding the insulating film therebetween. A semiconductor device having a semiconductor element such as a transistor is formed by using the semiconductor film. The transistor has a cavity between the semiconductor film used as an active layer and the base substrate. The single cavity or the plurality of cavities may be employed. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
申请公布号 |
JP2008294408(A) |
申请公布日期 |
2008.12.04 |
申请号 |
JP20080073142 |
申请日期 |
2008.03.21 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
MIYAIRI HIDEKAZU |
分类号 |
H01L29/786;H01L21/02;H01L21/336;H01L27/12 |
主分类号 |
H01L29/786 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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