发明名称 SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can achieve low power consumption by reducing the junction capacitance as compared with prior art by a simpler process, and to provide a manufacturing method thereof. <P>SOLUTION: A semiconductor film having a cavity between itself and a base substrate is formed on a base substrate by forming an insulating film having an opening on the base substrate and transposing a portion of a bond substrate to the base substrate while holding the insulating film therebetween. A semiconductor device having a semiconductor element such as a transistor is formed by using the semiconductor film. The transistor has a cavity between the semiconductor film used as an active layer and the base substrate. The single cavity or the plurality of cavities may be employed. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2008294408(A) 申请公布日期 2008.12.04
申请号 JP20080073142 申请日期 2008.03.21
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 MIYAIRI HIDEKAZU
分类号 H01L29/786;H01L21/02;H01L21/336;H01L27/12 主分类号 H01L29/786
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