| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive composition for a molding which is capable of giving a molding having s excellent curing property, scratch resistance, stiffness, transparency and adhesiveness to a base material, and the molding obtained by curing and molding the composition. SOLUTION: The photosensitive composition for the molding comprises a (metha) acryloyl group-containing compound (A) and a photopolymerization initiator (B), wherein the (metha) acryloyl group concentration is 3-10 mmol/g and the molecular weight between crosslinking points required by the (A) is 60-200. COPYRIGHT: (C)2009,JPO&INPIT
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