SEMICONDUCTOR PACKAGE STRUCTURE AND ITS METHOD

摘要

A semiconductor packaging structure and a packaging method are provided to prevent the damage of die by suppressing the exfoliation, the crack and the short of die. A semiconductor packaging structure is made of the substrate(7), substrate adhesion layer(8), first die(1), die glue layer(10), second die(2). The substrate adhesion layer is formed on the top of the substrate. The first die is formed on the substrate adhesion layer. The first die is connected to substrate with the first bonding wire(3). The die glue layer is formed on the first die. The die glue layer is the two-layer structure covering the first bonding wire. The second die is formed on the die glue layer of the two-layer structure. The second die is connected to substrate with the second bonding wire. The glue layer(5) of the paste type is formed so that the die glue layer of the two-layer structure completely covers the first bonding wire located on the first die. The upper side of the die glue layer of the two-layer structure is the glue layer(6) of the film type.