发明名称 POLISHING DEVICE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a polishing device preventing inclination and lowering due to a pressure received from a polishing body in the case of polishing by a supporting section whose height is set once regarding the supporting section supporting the protruding section of the polishing body protruded from the substance to be polished to the periphery thereof. <P>SOLUTION: The supporting section 9 is fitted along the outer peripheral section of a substrate so as to support the protruding section of a polishing pad 8 protruded to the periphery of the substrate 2 when polishing the substrate 2. The supporting section 9 is connected to an annular pneumatic cylinder 12 along the outer peripheral section of a substrate holding section 3 via a plurality of piston rods 16, and moved vertically. The pneumatic cylinder 12 is driven at the time of polishing, the heights of the surface to be polished of the substrate 2 and the supporting surface of the supporting section 9 are equalized approximately and a balanced pressure is applied to both cylinder chambers 14a and 14b when both reach the approximately same height. The pneumatic cylinder 12 has a large pressure-receiving area because it has an annular piston 15, and the supporting section 9 is difficult to displace even when it receives the pressure from the polishing pad 8 in the case of the polishing. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008294093(A) 申请公布日期 2008.12.04
申请号 JP20070136062 申请日期 2007.05.22
申请人 NIKON CORP 发明人 ASADA NAOKI
分类号 H01L21/304;B24B37/10 主分类号 H01L21/304
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