| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that has improved thermal conductivity from a semiconductor element to a heat radiator and can exhibit superior stress-relaxating function. SOLUTION: In the semiconductor device 10 includes a circuit board 11, where a metal circuit 15 is jointed to one surface 14a in a ceramic substrate 14 and a metal plate 16 is joined to the other surface 14b, a semiconductor element 12 is jointed to the metal circuit 15, and a heat sink 13 for cooling the semiconductor element 12 is thermally coupled to the metal plate 16 via a stress-relaxing member 20. The stress-relaxing member 20 is made of a material having high thermal conductivity, and a recess 21 is formed at the periphery of the stress relaxation member 20. COPYRIGHT: (C)2009,JPO&INPIT |
