| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure bonding device with pressure bonding test function, which can measure and manage the degree of pressure bonding with high accuracy. SOLUTION: The pressure bonding device is provided with an air cylinder and a die section equipped with a bottom tool 114 and a top force 115 and placed above the air cylinder. The bottom tool is installed such that it is pushed upward by the air cylinder against the top force and a sensor plate is fixed onto the bottom tool. In addition the device is provided with a contact type sensor in parallel with the die and a pressure bonding test equipment 20 for measuring the position of a terminal of the contact type sensor moved with its end in contact with the sensor plate as a measured value. COPYRIGHT: (C)2009,JPO&INPIT
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