HEAT SPREADER FOR SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE HEAT SPREADER

摘要

Provided are a heat spreader for a semiconductor device and a method for manufacturing the heat spreader. In the heat spreader, many pin-shaped fins are bonded not to be easily broken even when the fins are assembled into a semiconductor device heat dissipating structure which is to be directly cooled with water. A semiconductor device heat spreader (1) is provided with a plurality of columnar members (13) bonded onto at least one surface of board-like members (11, 12) by stud welding, and a bonding layer (14) formed between the board-like members (11, 12) and the columnar members (13). The board-like members (11, 12) include a base member (11) and a surface layer (12). The surface layer (12) and the columnar members (13) are composed of a material containing aluminum or an aluminum alloy. The thickness of the board-like members (11, 12) is 0.5-6mm, and the thickness of the surface layer (12) is 0.1-1mm. The bonding layer (14) has a bonding interface (15) at a boundary between the bonding layer and the board-like members (11, 12). The ratio of the bonding interface (15) existing in the surface layer (12) is 50% or more but not more than 100% when converted into a projection flat surface onto one surface of the board-like members (11, 12).