发明名称 WIRING PATTERN CONNECTING METHOD, WIRING SHEET, AND WIRING SHEET LAMINATE
摘要 <p><P>PROBLEM TO BE SOLVED: To carry out a perfect, effective, and highly reliable connection by a simple process. <P>SOLUTION: The wiring pattern connecting method is to connect the wiring pattern in a wiring sheet which has a wiring pattern and a through hole positioned on a flexible supporter on the surface and back of the flexible supporter respectively. A solution, which contains at least conductive material to dry and form a conductive portion, is applied to an area which contains at least an edge surrounding the through hole to connect each wiring pattern through the formed conductive portion. Whereby, the wiring patterns of the surface and back can be electrically connected through the through hole. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2008294244(A) 申请公布日期 2008.12.04
申请号 JP20070138521 申请日期 2007.05.25
申请人 RICOH CO LTD 发明人 SEKIYA TAKURO
分类号 H05K3/40;H05K1/11;H05K3/46 主分类号 H05K3/40
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