| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection method allowing sure wiping operation and Kelvin contact in the electric characteristics inspection of a semiconductor device having a bump ball. SOLUTION: The method for inspecting the electric characteristics of a semiconductor having a spherical external electrode uses a plurality of, or a pair of, cantilever type contacts, of which the tip is a planar having an edge on its periphery, of which the cross-sectional diameter of the tip is larger than the radius of the spherical external electrode, and which are supported by a support plate at predetermined positions. When the support plate or the semiconductor device is pressed, each edge of the pair of contacts is brought into contact with each of the surfaces of the spherical external electrode divided by the center line of the spherical external electrode passing through the midway between the two points at which the pair of contacts are supported, thereby achieving Kelvin contact. Furthermore, when the support plate or the semiconductor device is overdriven, the edges of the contacts slide over the surface of the spherical external electrode, thereby performing wiping. COPYRIGHT: (C)2009,JPO&INPIT
|
