| 摘要 |
A light-emitting element 10 is fixed on a lead frame 20 with a die-bonding member 13. The light-emitting element 10 is sealed with a silicone resin 22 and further sealed with an epoxy resin 24 from above the silicone resin 22. The die-bonding member 13 is obtainable by dispersing titanium oxide into an alicyclic epoxy resin obtained by curing an alicyclic epoxy compound with a curing agent.
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