发明名称 LIGHT-EMITTING DIODE LEAD FRAME AND MANUFACTURE METHOD THEREOF
摘要 The invention discloses an LED lead frame and the manufacture method thereof. First, a press-formed strip including a guide strip, a first metal frame, and a second metal frame is provided. The first metal frame and the second metal frame are connected to the guide strip and are connected to each other via a connection part. The first metal frame includes a first region. The second metal frame includes a second region. The connection part includes a third region. Then, the press-formed strip is clipped by a fixture such that the first region and the second region are exposed. Then, the press-formed strip is put in an electroplate solution and an electroplate layer is plated on the first region and the second region, but not on the third region. At last, the fixture is removed. The LED lead frame is then obtained.
申请公布号 US2008296604(A1) 申请公布日期 2008.12.04
申请号 US20080127309 申请日期 2008.05.27
申请人 I-CHIUN PRECISION INDUSTRY CO., LTD. 发明人 CHOU WAN-SHUN;CHU HSIN-CHANG;CHANG MING-CHIN;HSIHE HSI-CHEN
分类号 H01L21/50;H01L33/50;H01L33/56;H01L33/62 主分类号 H01L21/50
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