| 摘要 |
The invention relates to a package system and a method for producing said system for modular superstructures of function modules, designed to be used as a construction kit, in particular in microsystems technology. The aim of the invention is to reduce the number of individual parts of the package system, to provide at least two rewiring planes, to create one or more interfaces to known package concepts and on the level of the general concept to reduce costs. The inventive package system for modular superstructures consists of an obligatory part in the form of a tray or double tray, produced from an organometallic material. Additional, optional parts can be added to enhance the package system with regard to additional protective functions, higher integration grades and coupling to other trays of different sizes in the same system and to other package systems. According to the inventive method, the electric conductor tracks, connection structures, electric feedthroughs and the pad-line structures are geometrically structured by a laser, activated and subsequently plated. |
