Wafer-Auffang-Vorrichtung

摘要

Device for collecting a number of wafers to be separated by a holding element comprises a frame, a holder (41) connected to a frame for holding the holding element, lateral guiding elements and a lower collecting element. Preferred Features: The lateral guiding elements are arranged above each other in pairs in the transverse direction. The holder can be exchanged. The guiding elements are provided with a soft plastic on its surfaces to prevent damage from the wafers.