发明名称 POSITIVE RESIST COMPOSITION FOR IMMERSION EXPOSURE AND METHOD OF FORMING RESIST PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist composition for immersion exposure having good lithography characteristics and also having hydrophobicity suitable for immersion exposure, and a method of forming a resist pattern. <P>SOLUTION: The positive resist composition for immersion exposure includes: a base ingredient (A) whose solubility in an alkali developer increases by the action of an acid and which has no structural unit (c0) represented by specific chemical formula; an acid generator ingredient (B) which generates an acid upon exposure to light; and a fluorine-containing high molecular compound (C) having the structural unit (c0) and a structural unit (c1) derived from an acrylic ester containing an acid-dissociable dissolution inhibiting group. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008292580(A) 申请公布日期 2008.12.04
申请号 JP20070135781 申请日期 2007.05.22
申请人 TOKYO OHKA KOGYO CO LTD 发明人 UCHIUMI YOSHIYUKI;YOSHII YASUHIRO
分类号 G03F7/039;C08F220/10;G03F7/027;H01L21/027 主分类号 G03F7/039
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