| 发明名称 |
Copper (I) Complexes for Deposition of Copper Films by Atomic Layer Deposition |
| 摘要 |
The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process.
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| 申请公布号 |
US2008299322(A1) |
申请公布日期 |
2008.12.04 |
| 申请号 |
US20050658368 |
申请日期 |
2005.07.29 |
| 申请人 |
ALEXANDER ZAK BRADLEY;THOMPSON JEFFERY SCOTT;PARK KYUNG-HO |
发明人 |
ALEXANDER ZAK BRADLEY;THOMPSON JEFFERY SCOTT;PARK KYUNG-HO |
| 分类号 |
B05D1/18;C07F1/08 |
主分类号 |
B05D1/18 |
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