| 发明名称 |
EPOXY RESIN CURABLE COMPOSITION FOR PREPREG |
| 摘要 |
<p>Disclosed is an epoxy resin curable composition for use in a prepreg, wherein the composition comprises the following components (A) to (E): (A) a polyamide compound which has a structure derived from an aromatic diamine having a phenolic hydroxyl group and has the phenolic hydroxyl group at a position adjacent to an amino group; (B) an epoxy resin; (C) an epoxy resin-curing agent; (D) a filler; and (E) a solvent. ® KIPO & WIPO 2009</p> |
| 申请公布号 |
KR20080106172(A) |
申请公布日期 |
2008.12.04 |
| 申请号 |
KR20087019058 |
申请日期 |
2007.02.08 |
| 申请人 |
ADEKA CORPORATION |
发明人 |
TAKAHATA YOSHINORI;MORI TAKAHIRO;SAITO SEIICHI;IDE MITSUNORI;FUKUDA YOSHIHIRO |
| 分类号 |
C08G59/40;C08J5/24;C08L63/00;H05K1/03 |
主分类号 |
C08G59/40 |
| 代理机构 |
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代理人 |
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| 主权项 |
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