| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a new method for supplying solder to a substrate, capable of evading defective connection to easily occur in one pad part different in opening size when performing reflow in a solder bump by placing a chip on a substrate with connection terminals (pads) different in opening size, and suppressing the occurrence of short-circuiting to be caused by the flow-out of the partial solder in the bump in performing the reflow. <P>SOLUTION: The substrate 1 includes two or more kinds of connection terminals 4, 5 different in opening size. Solder is supplied onto the respective connection terminals 4, 5 by controlling the amounts of the solder, thereby allowing a difference in the contents of substances, existing in the solder after reflow on the connection terminals 4, 5 and diffused to the solder from the connection terminals 4, 5 by the reflow, to be ≤0.2 wt%. <P>COPYRIGHT: (C)2009,JPO&INPIT |
