发明名称 HEAT TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a heat treatment device capable of making a sublimate generated from a workpiece to be heat-treated in heat treatment hardly flow out to a latter part of a gas lead-out hole. SOLUTION: In this heat treatment device 1A wherein the workpiece W to be heat-treated is received in a state of being taking in and out, in a heat treatment chamber 11 of a device body 10 incorporating a heating chamber 12 and a heat treatment chamber 11 communicated with each other, a gas for heat treatment, introduced from the gas lead-in hole 14 formed on a part corresponding to the heating chamber 12 of the device body 10 is heated in the heating chamber 12 to perform the heat treatment on the workpiece W, and the heat-treated gas is led out from the gas lead-out hole 16 formed on a part corresponding to the heat treatment chamber 11 of the device body 10, a catalyst 22 for decomposing the sublimate A generated from the workpiece W included in the heat-treated gas is disposed in a state of closing an inlet 16a of the gas lead-out hole 16. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008292012(A) 申请公布日期 2008.12.04
申请号 JP20070135291 申请日期 2007.05.22
申请人 ESPEC CORP 发明人 TEZENI NAGAMITSU
分类号 F27D17/00;F27D7/04 主分类号 F27D17/00
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