| 摘要 |
PROBLEM TO BE SOLVED: To provide a fault detecting method and a fault detecting device of a semiconductor manufacturing apparatus for preventing a decrease in facility operating efficiency, a drop in throughput, and an increment in suspended time of the facility. SOLUTION: An apparatus status monitoring section 102 is connected in series or in parallel within the semiconductor manufacturing apparatus 105 to monitor the input and output status of wafers in a plurality of processing sections forming a wafer carrying path. A fault detecting section 103 measures a wafer holding time in each processing section on the basis of the wafer input and output status. Moreover, the presence or absence of a fault can be determined by comparing the wafer holding time in each processing section with the reference time preset for each processing section. A fault notifying section 104 notifies the semiconductor manufacturing apparatus 105 and a host computer 107 of the fault in accordance with the determination result of the fault detecting section 103. COPYRIGHT: (C)2009,JPO&INPIT
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