| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a cyanogen-free type copper-tin alloy plating, which can prevent the formed coating film from causing peeling or cracking due to continually given impacts, even when the coating film has thickness as thick as 2μm or more, which has been a problem of the cyanogen-free type copper-tin alloy plating. SOLUTION: The method for producing the copper-tin alloy plating superior in continual-impact resistance comprises the steps of: electroplating a base material (1) which is selected from a metal or a ceramic having a metal layer on its surface, or (2) which is selected from plastics having a metal layer on their surfaces, in a copper-tin alloy plating bath that is constituted by at least a soluble copper salt and a soluble stannic salt, an organic acid and/or an inorganic acid and/or a soluble salt thereof, and a specific addition agent (brightener), and does not contain a cyanogen; and baking the base material (1) or (2) on a specific condition which is different between the base materials (1) and (2). COPYRIGHT: (C)2009,JPO&INPIT
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