发明名称 |
WIRING BOARD AND ITS FABRICATING METHOD |
摘要 |
A wiring board has predetermined numbers of wiring layers and insulating layers among the respective wiring layers. The wiring board has an external connecting pad and a surface plating layer for connecting to an external circuit is arranged on the external connecting pad. An area of an external connecting pad is smaller than an area of a surface plating layer thereof.
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申请公布号 |
US2008298038(A1) |
申请公布日期 |
2008.12.04 |
申请号 |
US20080126329 |
申请日期 |
2008.05.23 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
KANEKO KENTARO |
分类号 |
H05K7/02;H01R43/00 |
主分类号 |
H05K7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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