| 发明名称 |
RESIN COMPOSITION, RESIN SPACER FILM, AND SEMICONDUCTOR DEVICE |
| 摘要 |
<p>A resin composition is used as a resin spacer for forming a space between a substrate and a semiconductor element. The resin composition includes an alkali-soluble resin, a photopolymerizing resin, a photopolymerization initiator, and a filler in particle state. The average particle diameter of the filler is 0.05-0.35µm or less, and the content of the filler is 1-40wt%. A resin spacer film is composed of such resin composition.</p> |
| 申请公布号 |
WO2008146723(A1) |
申请公布日期 |
2008.12.04 |
| 申请号 |
WO2008JP59507 |
申请日期 |
2008.05.23 |
| 申请人 |
SUMITOMO BAKELITE COMPANY LIMITED;TAKAHASHI, TOYOSEI;TAKAYAMA, RIE |
发明人 |
TAKAHASHI, TOYOSEI;TAKAYAMA, RIE |
| 分类号 |
C08L101/00;C08J5/18;C08K3/00;G03F7/004;G03F7/027;G03F7/032;G03F7/038;H01L23/02 |
主分类号 |
C08L101/00 |
| 代理机构 |
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代理人 |
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