| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and program for obtaining a prober at a low cost which permits quick contacting operation of the prober to an electrode in the prober, for improved throughput. SOLUTION: The prober is equipped with a wafer chuck for retaining a wafer, an XY-moving mechanism and a Z-moving mechanism for moving the wafer chuck into the directions of X, Y and Z axes, a head stage 13 for retaining a probe card 23 and a head stage supporting mechanism, which changes the inclination of the head stage 13 and moves the same while being equipped with a motor 51, a gear 52, a feeding screw mechanism 54, a guide 56 and the like. Upon contacting an electrode with the probe 24, the electrode is moved to a position immediately below the probe by the XY-moving mechanism and, thereafter, the electrode is moved to a predetermined position, whereat the electrode is contacted with the probe, by the Z-moving mechanism, then, the head stage 13 is moved by the head stage supporting mechanism thereafter to contact the probe with the electrode under a contacting pressure within a predetermined range. COPYRIGHT: (C)2009,JPO&INPIT
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